SWCNT

Material overview: SWCNT — Material Properties & Applications

SWCNT coverage organized by application area. Use the sections below to navigate failure modes, mechanisms, and boundary conditions.

Lithium-Ion Batteries

• why carbon black fails to form stable conductive networks below 0 5
• why carbon black causes resistivity drift during fast charge discharge cycling
• why graphite additives reduce volumetric energy density at high electrode loadings
• why carbon black accelerates electrode cracking under high calendering pressure
• why conductive additives lose effectiveness as electrode thickness increases
• why cathode impedance rises despite increasing carbon black loading
• why carbon black networks degrade under silicon rich anode expansion
• why more carbon stops improving conductivity past a critical loading threshold
• how conductive networks evolve during fast charge discharge cycling
• when electrode thickness becomes the dominant limitation for conductivity
• what limits electronic percolation in high energy density electrodes
• under what conditions conductive networks collapse during cycling
• how carbon black and graphene based additives differ in conductive network stability
• how conductive additive cost scales with required loading level
• when higher cost conductive additives become economically justified by performance gains
• how total formulation cost changes with conductive network efficiency
• when carbon black becomes a performance bottleneck rather than a cost advantage
• at what electrode thickness conductive additives stop improving rate performance

EMI Shielding & Conductive Coatings

• why carbon black requires excessive loading to achieve emi shielding effectiveness
• why metal flake based coatings crack under repeated bending or thermal cycling
• why emi coatings lose conductivity after humidity and corrosion exposure
• why carbon black fails to provide broadband emi shielding at high frequencies
• why metal based emi fillers increase coating density without proportional shielding gains
• why conductive coatings show shielding degradation after abrasion and wear
• why thick emi coatings are required when percolation networks are inefficient
• how emi shielding efficiency changes with frequency and filler morphology
• when emi performance becomes limited by coating microstructure
• what limits emi attenuation in thin conductive coatings
• how emi shielding effectiveness compares between metal flakes and carbon based fillers
• how emi shielding cost scales with filler type and coating thickness
• when high loading emi coatings become economically inefficient
• when emi shielding performance becomes limited by geometry rather than material choice

Sensors

• why metal oxide gas sensors require high operating temperatures to function
• why conventional gas sensors suffer from long response and recovery times
• why metal based strain gauges lose sensitivity at small deformations
• why wearable sensors drift under continuous mechanical stress
• why humidity interferes with resistive gas sensor accuracy
• why traditional sensors fail to detect low ppm analytes reliably
• why rigid sensor materials limit integration into flexible substrates
• how sensor response time depends on surface adsorption kinetics
• when sensor drift becomes dominated by mechanical fatigue
• what limits detection of low ppm analytes in conventional sensors
• how cnt based sensors compare to metal oxide sensors in response time
• how sensor sensitivity per dollar compares across different sensing materials
• when low power sensors offset higher material costs
• when sensor accuracy becomes dominated by packaging rather than sensing material

Transparent Electrodes

• why ito cracks under repeated bending in flexible displays
• why ito sheet resistance increases after mechanical deformation
• why indium scarcity drives long term cost volatility in transparent electrodes
• why ito deposition is incompatible with low temperature substrates
• why ito performance degrades under tensile strain
• why ito electrodes fail in roll to roll manufacturing environments
• how transparency conductivity tradeoffs limit electrode design
• how flexible electrodes compare to ito in durability and electrical stability
• how transparent electrode cost varies with sheet resistance requirements
• when ito alternatives become cost competitive in flexible electronics
• when transparent electrode failure is driven by mechanics rather than conductivity

Polymer Matrix Composites

• why carbon black reinforcement requires high filler loading to be effective
• why traditional fillers fail to provide intrinsic damage sensing in composites
• why short carbon fibers compromise isotropic mechanical performance
• why conductive fillers disrupt resin flow during composite processing
• why conventional fillers fail to enable real time structural health monitoring
• why percolation based sensing networks break under cyclic fatigue
• how filler geometry affects mechanical isotropy in composites
• how composite reinforcement strategies compare in electrical and mechanical efficiency
• how composite performance per unit cost changes with filler selection
• when multifunctional fillers reduce overall system cost
• when composite electrical performance becomes limited by matrix properties instead of filler

Supercapacitors

• why activated carbon limits power density despite high surface area
• why pore size mismatch reduces ion accessibility in carbon electrodes
• why thick activated carbon electrodes suffer from high internal resistance
• why cycle life degrades under high current densities
• why energy density plateaus despite increasing surface area
• why electrode conductivity becomes the limiting factor at fast charge rates
• how ion transport kinetics limit high rate performance in supercapacitors
• when supercapacitor performance becomes limited by ion transport rather than surface area
• how supercapacitor electrode materials compare in cost per energy density
• how cost per farad varies across supercapacitor electrode technologies
• when high performance electrodes justify higher material cost

Semiconductor Electronics

• why copper interconnects fail under electromigration at advanced nodes
• why resistivity increases sharply in sub 10 nm copper lines
• why copper diffusion barriers consume excessive cross sectional area
• why heat dissipation limits scaling of metal interconnects
• how copper interconnects compare with alternative conductors at advanced nodes
• how interconnect material choice impacts cost at advanced technology nodes
• when interconnect scaling becomes thermally rather than electrically limited

Printed & Flexible Electronics

• why silver inks crack under repeated flexing
• why silver migration causes short circuits in printed electronics
• why ink conductivity drops after mechanical deformation
• why silver cost volatility limits large area printed electronics
• how ink cost and conductivity trade off in printed electronics
• when printed conductor cost outweighs performance benefit

Photonics & Optoelectronics

• why traditional photonic materials lack broadband optical tunability
• why rigid photonic substrates limit integration into flexible systems
• why thermal sensitivity degrades optoelectronic device stability
• how material choice affects cost per function in photonic devices

Quantum Devices

• why silicon devices face scaling limits in ballistic transport regimes
• how dimensional confinement alters charge transport behavior
• how material dimensionality impacts cost and performance in quantum devices
• when material choice becomes the dominant cost driver in quantum devices

General Conductive Materials

• how carbon black and carbon nanotubes compare in conductive efficiency at equal
• how graphene based fillers compare with carbon black in percolation threshold behavior
• how filler aspect ratio influences percolation threshold across conductive additives
• how electrical performance scales with filler loading in different conductive systems
• how mechanical durability compares between particulate and fibrous conductive fillers