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Single-Walled Carbon Nanotubes and Thick Porous Carbon Electrodes: Mechanistic roles in through-thickness internal resistance

Direct Answer

Direct answer: Thick activated-carbon electrodes exhibit higher through-thickness internal resistance because tortuous ionic pathways and insufficient electronic percolation increase transport path lengths; SWCNTs only meaningfully reduce resistance when they form a well-dispersed, volumetrically percolating, low-contact-resistanc...

Evidence anchor: Practitioners repeatedly observe rising internal resistance with electrode thickness in porous carbon-based electrodes during scale-up and high-rate testing.

Why this matters: Understanding which transport pathways dominate and when SWCNTs can or cannot help is necessary to avoid wasted material cost and incorrect design choices during electrode scale-up.

Introduction

Core mechanism: Ionic transport through the electrolyte-filled pore network and electronic transport through the carbon matrix act in series.

In thick activated-carbon electrodes, tortuosity and narrow pore bottlenecks increase ionic path length and slow ion access to internal surface area.

Discrete particle contacts and contact resistance reduce effective electronic conductivity across the electrode thickness.

Why this happens: This combined limitation commonly arises when electrode thickness exceeds characteristic ion diffusion lengths and when conductive additives or architectures fail to establish volumetric percolation, because ionic and electronic resistances then tend to scale with geometric path length.

Mechanical consolidation, binder distribution, and pore structure established during drying and calendering can kinetically lock tortuosity and contact topology, so surface-only fixes frequently do not restore low through-thickness resistance.

Physical consequence: As a result, mitigation typically requires interventions that alter the bulk connectivity of at least one transport domain (ionic or electronic) throughout the electrode volume.

Read an overview of the material: https://www.greatkela.com/en/use/electronic_materials/SWCNT/210.html
Read the application details (Supercapacitors): https://www.greatkela.com/en/use/electronic_materials/SWCNT/265.html

Common Failure Modes

Observed failure

Mechanism mismatch

Conditions That Change the Outcome

Electrode thickness and geometry

Pore size distribution and tortuosity

Conductive additive morphology and distribution

Binder content and distribution

Calendering/compaction and electrolyte wetting

How This Differs From Other Approaches

Porous-architecture approach (tuning pore morphology)

Continuous electronic scaffold (embedded current collectors/fibers)

Nanoscale conductive additives (SWCNTs, graphene flakes)

Surface coatings/conformal conductive layers

Scope and Limitations

Applies to

Does not apply to

When results may not transfer

Separate causal pathways

Engineer Questions

Q: Will adding a surface layer of SWCNTs reduce the internal resistance of a 200 μm thick activated-carbon electrode?

A: Unlikely — surface-only SWCNT layers typically improve near-surface electronic conduction but do not create volumetric percolation; therefore they usually do not reduce through-thickness ionic or electronic bottlenecks unless they also enable network penetration or change pore/ionic access.

Q: How can I tell whether ionic tortuosity or electronic percolation is the dominant contributor to internal resistance?

A: Use EIS to separate high-frequency (Ohmic/contact) and low-frequency (diffusion/Warburg) components, correlate with cross-sectional imaging (μCT or SEM) for pore/connective morphology, and perform rate-capacity tests at varying electrolyte conductivities to see which changes reduce polarization most.

Q: Do SWCNTs always reduce contact resistance between carbon particles?

A: Not always — SWCNTs reduce contact resistance only if they are well-dispersed, debundled, and form an interconnected network that bridges particle contacts; aggregated SWCNTs or those confined to one region can be electrically isolated and ineffective.

Q: What processing changes most reliably lower ionic resistance in thick electrodes?

A: Reducing tortuosity via controlled pore-forming strategies (templating, sacrificial pore formers), optimizing calendering to preserve through-thickness pore connectivity, and ensuring full electrolyte wetting are primary levers because they shorten effective ionic path lengths and improve ion access to internal surface area.

Q: Is it better to increase binder or increase conductive additive loading to lower internal resistance?

A: Neither is universally better: higher binder can improve mechanical integrity and contact area but may insulate contacts and increase tortuosity, while higher conductive additive can help electronic percolation but may disrupt pore structure and electrolyte access; decisions should be guided by which transport domain (ionic vs electronic) is limiting.

Q: Can embedding thin metal fibers or current-collector mesh inside the electrode reduce internal resistance more effectively than SWCNTs?

A: Embedding a continuous metallic scaffold provides direct electronic pathways to the current collector and therefore can bypass electronic percolation limits, but it does not reduce ionic tortuosity and its net effect depends on preserving ionic access and avoiding pore blockage.

Related links

comparative-analysis

cost-analysis

decision-threshold

degradation-mechanism

mechanism-exploration

performance-limitation

physical-limitation

Last updated: 2026-01-18

Change log: 2026-01-18 — Initial release.