TI Index of Hexagonal Boron Nitride

See material in application: hexagonal boron nitride in dispensable TIM pastes

Start here

• Why do insulating TIM pastes plateau at high filler loading?
• Why can high h-BN filler loading in TIMs worsen device temperatures?
• What causes TIM pump-out, dry-out, and interface resistance growth?

Is it right for my use?

• When to Select Hexagonal Boron Nitride (h-BN) as a Primary TIM Filler
• Can h-BN replace Al₂O₃ in my TIM format? (Evaluation Plan)

Must-know constraints

• Why h-BN Fails at Ultra-Thin Bondlines
• Why specify 99.9% vs 99.5% purity hexagonal boron nitride for TIMs?
• Why h-BN Replaces Graphene in High-Voltage Thermal Management
• When to switch from Al₂O₃ to h-BN for thermal management?
• AlN vs h-BN: When Aluminum Nitride Outperforms Boron Nitride
• How h-BN platelet morphology affects viscosity and bond line thickness compared to spherical fillers

Compare options

• Why natural platelet alignment limits through-plane heat flow in hBN TIMs
• Why does interface resistance dominate hBN TIM performance in high-flux stacks?
• Why PSD beats “average particle size” in TIM performance

How to test & implement

• How to Disperse hBN in Silicone TIMs Without Viscosity Runaway
• Preventing Thermal Pathway Collapse When Reducing hBN Paste Viscosity
• How to Select h-BN TIM Format: Paste vs Pad vs Gel for Variable Gaps

Safety, handling & spec checklist

• How to validate reliability and QA consistency for h-BN TIMs?
• How to handle h-BN powder safely: Dust control and toxicity limits